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Ultra Deep Sub-Micron Foundation and Platform Technology

NetherlandsTenders notice for Ultra Deep Sub-Micron Foundation and Platform Technology. The reference ID of the tender is 100428739 and it is closing on 17 Jun 2024.

Tender Details

  • Country: Netherlands
  • Summary: Ultra Deep Sub-Micron Foundation and Platform Technology
  • NLT Ref No: 100428739
  • Deadline: 17 Jun 2024
  • Financier: Other Funding Agencies
  • Purchaser Ownership: Government
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: 1-12149
  • Purchaser's Detail:
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  • Description:
  • Tenders are invited for Ultra Deep Sub-Micron Foundation and Platform Technology Price Range 500 KEURO The electrical power available in space is a precious resource and sets bounds on the functionality and performance realisable in spacecrafts. Advances in semiconductor technology over years have been able to push these boundaries further afield for Earth Observation, Exploration, Science missions and Telecommunications. Thanks to ESA, European Commission and national funding, Field Programmable Gate Array (FPGA) Brave Family and GR7xx microprocessors have been successfully developed using 65nm and 28nm technologies. New technologies (e.g. N7 also known as 7nm FinFet technology) have much to offer to the next generation of devices and would target afourfold increase in digital gate density, power efficiency and highspeed serial line communication speed. Indeed, the 112Gbps high-speed serial interface cannot be realised on the Fully Depleted Silicon on Insulator (FDSOI) 28/22nm technology.The increasing cost and complexity of the advanced technology necessitates to leverage the existing Intellectual Property (IP) core functional blocks to the fullest extent. Only moving those functions that benefit significantly from a port and/or enhancement should be considered. Specifically, the digital logic and high speed serial interfaces are prime candidates. Slower and higher voltage as well as analogfunctionality should remain in the FDSOI 28/22nm technology, where the cost of their port does not weight up against the accrued benefit. This approach, also known as chiplet architecture, uses a low-latency lowpower die-to-die interface on an organic substrateto link the different dies in the current technologies
  • Documents:

 Tender Notice

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Ultra Deep Sub-Micron Foundation and Platform Technology - Netherlands Tender

The EUROPEAN SPACE RESEARCH AND TECHNOLOGY CENTRE, a Government sector organization in Netherlands, has announced a new tender for Ultra Deep Sub-Micron Foundation and Platform Technology. This tender is published on NetherlandsTenders under NLT Ref No: 100428739 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2024-06-17.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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