Initial Reliability Assessment of Fan-Out Wafer Level Packaging for Space

• Country: Netherlands
• Summary: Initial Reliability Assessment of Fan-Out Wafer Level Packaging for Space
• NLT Ref No: 92085942
• Deadline: 05 Jan 2024
• Financier: Agency for the Cooperation of Energy Regulators (ACER)
• Purchaser Ownership: Government
• Tender Value: Refer Document
• Notice Type: Tender
• Document Ref. No.: 1-11753
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• Description:
• Tenders are invited for Initial Reliability Assessment of Fan-Out Wafer Level Packaging for Space. It has been acknowledged the need for higher levels of integration as the technology evolves to more complex structures and higher frequencies. In that context, a Heterogeneous integration or System-in-Package (SiP) solution, where different types of active semiconductor technologies can be assembled together, is deemed as the most cost-effective solution when compared to System-on-Chip (SoC)designs.The proposed new packaging technique, Fan-out Wafer Level Packaging (FOWLP), even though, it cannot be used to assemble a complete system, is commonly employed as a building block of almost any System-in-Package. In a FOWLP, redistribution layers (RDL) are used to re-route the connections both inwards and outwards the chip surface, thus increasing the possible number of I/Os. In addition, RDLs can also provide embedded passives (R, L, C) as well as antenna structures using a multi-layer structure. FOWLP provides the benefit of a smaller footprint than an equivalent ball grid array (BGA) and helps in reducing the parasitic of wire connections by reducing the length of them.This technology exists already in the commercial market for several years and the available reports show maturity enough for their possible introduction into the space applications. This activity aims at assessing the reliability level of this type of packages and of the limitations when placed in relevant space environment conditions.This activity encompasses the following tasks:- Definition and review of product requirements- Manufacturing of prototype samples- Reliability testing campaign definition and execution- Way forward to qualificationProcurement Policy: C(2) = A relevant participation (in terms of quality and quantity) of non-primes (incl. SMEs) is required. For additional information please go to:http://www.esa.int/About_Us/Business_with_ESA/Small_and_Medium_Sized_Enterprises/Opportunities_for_SMEs/Procurement_policy_on_fair_access_for_SMEs_-_the_C1-C4_Clauses. Price Range: 500 KEURO. Clarification Request Deadline 22/12/2023 13:00 CET Closing Date Extension Request Deadline 22/12/2023 13:00 CET Announcement Date 31/03/2023 Last Update On 10/11/2023 16:53 CET.
• Documents:

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