European Tender Dry Etcher

• Country: Netherlands
• Summary: European Tender Dry Etcher
• NLT Ref No: 101755538
• Deadline: 15 Jul 2024
• Financier: Self Financed
• Purchaser Ownership: Government
• Tender Value: EUR 1050000
• Notice Type: Tender
• Document Ref. No.: 311521-2024
• Purchaser's Detail:
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• Description:
• The MESA+ Institute will invest in a new Dry Etch tool system to reinforce their state-of-the-art etch capabilities and etch capacity. Applications: The tool must be capable of etching silicon and/or silicon-based materials for a variety of nano- and/or microscale structures with nanometre precision and high wafer-scale uniformity. The tool must be suitable for the etching of silicon-based materials with etch rates of 1 nm/min up to 15 µm/min. The tool must be equipped with reliable end-pointing, also for loadings of The required nanometric precision of the tool is defined as the wafer-scale controllability in three-dimensional micro- and nano-machining of silicon and/or silicon-based materials. A uniform plasma density is required for highly adjustable control over the x- and y-dimensions (lateral) upon etching in the z-direction (depth), with an accuracy ± 2 nm using fluor-based chemistries with processes containing the gases Ar, O2, N2, SF6, and C4F8. The required high uniformity of the tool is defined as a uniform plasma ion density across the wafer, providing a uniform etching performance for wafer sizes of 100 mm and 150 mm, for etching a variety of nano- and/or microscale structures. The required etch performance of the tool must be achieved by a dual ICP source chamber design, utilizing a main ICP source located on top of the chamber and a second ICP source located in the side wall of the chamber close to the substrate. It is essential that the plasma zones are decou...
• Documents:

 Tender Notice